Rekha, S. and Srinivasan, K.N. and John, S. (2010) Electroless deposition of copper from methane sulphonate complexed bath. Transactions of the Institute of Metal Finishing, 88 (4). ISSN 0020-2967

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Abstract

Electroless copper deposition is widely used for printed circuit applications. A new bath based on copper methane sulphonate replacing copper sulphate, EDTA and paraformaldehyde has been developed, which is very useful for plating on non-conductors and through hole plating in printed circuit manufacturing processes. The new bath has a higher rate of deposition of 3?3 mm h21 than the conventional sulphate bath (with a rate of 1?5 mm h21) and the bath stability and the quality of the deposits are very good. Scanning electron microscopy, X-ray diffraction and atomic force microscopy studies have been carried out and the crystallite size of the copper is measured to be 134 nm with a preferred orientation of 200 planes. The deposit obtained is pure copper and the surface roughness is of the order of 10 nm.

Item Type:	Article
Uncontrolled Keywords:	Electroless copper; Methane sulphonate; Chemical deposition; Paraformaldehyde; PCB industries
Subjects:	Industrial Metal Finishing
Divisions:	UNSPECIFIED
Depositing User:	ttbdar CECRI
Date Deposited:	09 Apr 2012 02:42
Last Modified:	09 Apr 2012 02:42
URI:	http://cecri.csircentral.net/id/eprint/562

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