Saravanan, G. and Mohan, S. (2013) Nucleation of copper on mild steel in copper chloride (CuCl2�2H2O)–1-ethyl-3-methylimidazolium chloride [EMIM]Cl–ethylene glycol (EG) ionic liquid. New Journal of Chemistry, 37. pp. 2564-2567. ISSN 1144-0546

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Abstract

A dense and adhesive Cu layer was successfully electrodeposited on mild steel in a copper chloride (CuCl2�2H2O)–1-ethyl-3-methylimidazolium chloride [EMIM]Cl–ethylene glycol [EG] ionic liquid. The mechanism of copper nucleation is studied using cyclic voltammetry and chronoamperometry. It is observed that 3D-instantaneous nucleation leads to a bright nano-structured deposit. The morphology of the deposit was characterized SEM and X-ray diffraction techniques. The deposition method was found to take place in an environmentally friendly green electrolyte without co-ligands such as cyanide and volatile toxic solvents

Item Type:	Article
Uncontrolled Keywords:	Mild steel; ionic liquid; copper
Subjects:	Industrial Metal Finishing
Divisions:	UNSPECIFIED
Depositing User:	Dr. N Meyyappan
Date Deposited:	05 Jan 2015 08:30
Last Modified:	05 Jan 2015 08:30
URI:	http://cecri.csircentral.net/id/eprint/3120

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