John, S. and Shanmugam, N.V. and Srinivasan, K.N. and Selvam, M. and Shenoi, B.A. (1982) Electroplated tin-nickel alloy as a mandrel surface for electroforming of copper foils. Journal of Electrochemical Society of India, 31 (01). pp. 32-34.

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Abstract

Copper foil has been produced for many years by electroforming technique, the major use of such foil is in copper clad plastic laminates for use in the manufacture of printed circuits. In the production of copper foils various mandrel materials like chromium, nickel, stainless steel, lead, titanium, rhenium has been employed. These mandrels very often produces porous foil unsuitable for printed circuits. The present investigation was undertaken with a view to develop a suitable mandrel to produce copper foil acceptable for printed circuit production. Electrodeposited tin-nickel alloy has been found to posses good corrosion resistance and preferred in certain applications than decorative chromium. A passive film is also said to form on this surface similar to chromium. Hence electroplated tin-nickel alloy mandrel was prepared using the electrolytes reported in the literature and copper foils were electroformed over this mandrel. It has been found that electroplated tin-nickel alloy mandrel produces less number of pores in comparison to chromium and stainless steel. This mandrel has also been utilized for the production of screens by photographic masking and electroforming technique

Item Type:	Article
Uncontrolled Keywords:	Tin-nickel alloy; Mandrel surface; Electroforming; Copper foils
Subjects:	Industrial Metal Finishing
Divisions:	UNSPECIFIED
Depositing User:	ttbdu cecri
Date Deposited:	01 Nov 2012 13:12
Last Modified:	01 Nov 2012 13:12
URI:	http://cecri.csircentral.net/id/eprint/2875

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