Krishnan, R.M. and Eleankovan, T. and Aruna, A. and Sriveeraraghavan, S. and Sobha , J. and Natarajan, S.R. (1996) Effect of organic acids in nickel plating. Bulletin of Electrochemistry, 12 (5-6). pp. 270-273. ISSN 0256-1654

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Abstract

Electrodeposition of nickel is largely carried out as an undercoat in decorative nickel-chromium plating. During the process of nickel plating, the solution pH tends to rise because of depletion of hydrogen ions due to hydrogen evolution from the layer of solution surrounding the cathode. It thus becomes necessary to maintain the pH of plating solution within the appropriate range for ensuring production of deposits with desirable properties. In this paper the authors report the effects of certain buffering ingredients, namely acetate, citrate, succinate and tartrate in nickel plating solutions. The experimental results point to the suitability of acetate as a superior buffering agent for a nickel plating bath.

Item Type:	Article
Uncontrolled Keywords:	Nickel plating; acetate and hull cell
Subjects:	Industrial Metal Finishing
Divisions:	UNSPECIFIED
Depositing User:	ttbdar CECRI
Date Deposited:	23 May 2012 09:19
Last Modified:	23 May 2012 09:19
URI:	http://cecri.csircentral.net/id/eprint/2710

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