Karuppiah, N. and Srinivasan, K.N. and Selvam, M.
(1996)
Electroless Nickel Film Resistors for electronic industry.
Bulletin of Electrochemistry, 12 (5-6).
pp. 266-269.
ISSN 0256-1654
Abstract
Electroless nickel plating is used increasingly for electronic parts because it can used for virtually any substrate, whether ceramic, metallic or nonconducting plastics. Resistors used in electronic circuits are normally prepared using carbon or metal films formed by dry processes like sputtering or vaccum deposition on non conducting ceramic substrates. The diameter and the length of substrate varies depending on the resistance and wattage required. The use of such films result in appreciable value of temperature co-efficient. In order to reduce the temperature co-efficient of such resistors, usually a non metal is incorporated in the film. In the investigations now reported, electroless nickel-phosphorous alloy was coated on the ceramic resistors. Because of codeposition of 3-14% phosphorous in the case of electroless nickel phosphorous alloy plating, the temperature co-efficient values of the resistor films thus produced become low. The effects of variation of various parameters of the bath such as composition, pH and temperature on the temperature co-efficients of Ni-P film resistors are reported in this paper. By suitably adjusting the bath operating conditions, temperature co-efficient values of 30 to 60 ppm for nickel-phosphorous alloy coated ceramic resistors could be obtained as required for their use in electronic circuits.
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