Mohan, S. and Raj, V. (2005) A comparative study of DC and pulse gold electrodeposits. Transactions of the Institute of Metal Finishing, 83 (2). pp. 72-76. ISSN 0020-2967

PDF Restricted to Registered users only Download (166Kb) | Request a copy

Abstract

Gold deposits were formed on AA 1100 aluminium alloy using a simple chemical pretreatment both by direct current plating (DCP) and pulsed current deposition (PCD) methods. The surface properties of the gold deposits such as adhesion, porosity, surface morphology and corrosion resistance formed by both DCP and PCD methods were compared by analysing them using adhesion and porosity tests, scanning electron microscopy (SEM) and electrochemical impedance spectroscopy (EIS). From the analyses, it is observed that the gold film formed by the PCD method has a better corrosion resistance, less porosity and reduced grain size compared to that formed by the DCP method.

Item Type:	Article
Uncontrolled Keywords:	DCP; PCD; SEM; EIS; Corrosion and porosity; Gold; Aluminium
Subjects:	Industrial Metal Finishing
Divisions:	UNSPECIFIED
Depositing User:	TTBD CECRI
Date Deposited:	18 Jan 2012 11:50
Last Modified:	18 Jan 2012 11:50
URI:	http://cecri.csircentral.net/id/eprint/220

Actions (login required)

View Item