Balasubramanian, A. and Srikumar, D.S. and Raja, G. and Saravanan, G. and Mohan, S. (2009) Effect of pulse parameter on pulsed electrodeposition of copper on stainless steel. Surface Engineering, 25 (5). pp. 389-392. ISSN 0267-0844

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Abstract

The pulsed electrodeposition of copper on stainless steel has been studied in copper sulphate bath and the effect of duty cycle and frequency on the thickness and current efficiencies were compared at 50uC and at room temperature with average current density of 4 A dm22. A new strike bath based on cupric chloride and hydrochloric acid was developed for the first time. The Cu coatings were characterised by SEM, AFM and XRD. Crystallite sizes of Cu coatings were calculated for various duty cycles from the Scherer’s equation. The deposits were smaller nodules and fine grained.

Item Type:	Article
Uncontrolled Keywords:	Pulsed electrodeposition; On time; Off time; Duty cycle; Grain size
Subjects:	Industrial Metal Finishing
Divisions:	UNSPECIFIED
Depositing User:	ttbdu cecri
Date Deposited:	01 Apr 2012 11:38
Last Modified:	01 Apr 2012 11:38
URI:	http://cecri.csircentral.net/id/eprint/1201

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