Visalakshi, R. and Sriveeraraghavan, S. and Sekar, R. and Sobha , J. and Krishnan, R.M. (1999) A simple method for the preparation of ruthenium plating solution. Bulletin of Electrochemistry , 15 (7-8). pp. 238-241. ISSN 0256-1654

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Abstract

Ruthenium is the least expensive of the platinum group metals, and is an attractive altemative to both rhodium and gold in contact finish applications, as in electronics. Ruthenium in sealed-reed contacts to resist contact sticking, is a noteworthy application. However much ruthenium can be applied for a particular purpose, the availability of satisfactory electroplating processes demands an extensive investigation for the establishment of the same. Hence there is a need to get a standard basic electrolyte which can help getting a good uniform and smooth deposit of ruthenium ontinuously, witbout any deterioration of the electrolyte. Till today there has heen no citation in literatUl-e regarding the same. l11e present paper focuses on the method of preparation of ruthenium platin~ concentrate, it.. st.'lbility with time, and some of its performance characteristics.

Item Type:	Article
Uncontrolled Keywords:	Ruthenium; eleclrodeposition; concentrate
Subjects:	Industrial Metal Finishing
Divisions:	UNSPECIFIED
Depositing User:	ttbdar CECRI
Date Deposited:	24 Feb 2012 17:06
Last Modified:	24 Feb 2012 17:06
URI:	http://cecri.csircentral.net/id/eprint/1145

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