Saravanan, G. and Mohan, S. (2013) Nucleation of copper on mild steel in copper chloride (CuCl2�2H2O)–1-ethyl-3-methylimidazolium chloride [EMIM]Cl–ethylene glycol (EG) ionic liquid. New Journal of Chemistry, 37. pp. 2564-2567. ISSN 1144-0546

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A dense and adhesive Cu layer was successfully electrodeposited on mild steel in a copper chloride (CuCl2�2H2O)–1-ethyl-3-methylimidazolium chloride [EMIM]Cl–ethylene glycol [EG] ionic liquid. The mechanism of copper nucleation is studied using cyclic voltammetry and chronoamperometry. It is observed that 3D-instantaneous nucleation leads to a bright nano-structured deposit. The morphology of the deposit was characterized SEM and X-ray diffraction techniques. The deposition method was found to take place in an environmentally friendly green electrolyte without co-ligands such as cyanide and volatile toxic solvents

Item Type: Article
Uncontrolled Keywords: Mild steel; ionic liquid; copper
Subjects: Industrial Metal Finishing
Depositing User: Dr. N Meyyappan
Date Deposited: 05 Jan 2015 08:30
Last Modified: 05 Jan 2015 08:30

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