Group by: Item Type | No Grouping Number of items: 6. Mohan, S. and Raj, V. (2005) A comparative study of DC and pulse gold electrodeposits. Transactions of the Institute of Metal Finishing, 83 (2). pp. 72-76. ISSN 0020-2967 Mohan, S. and Raj, V. (2005) The effect of additives on the pulsed electrodeposition of copper. Transactions of the Institute of Metal Finishing, 83 (4). pp. 194-198. ISSN 0020-2967 Raj, V. and Kanagaraj, D. and Mohan, S. (2003) Effect of sealing agents on the corrosion behaviour of sulphamic acid anodized alumina films. Transactions of the Institute of Metal Finishing, 81 (03). pp. 83-88. ISSN 0020-2967 Raj, V. and Rajaram, M.P. and Balasubramanian, G. and Vincent, S. and Kanagaraj, D. (2003) Pulse anodizing - an overview. Transactions of the Institute of Metal Finishing, 81 (04). pp. 114-121. ISSN 0020-2967 Kanagaraj, D. and Raj, V. and Vincent, S. and Prasannakumar, B. and Senthilkumar, A. and Iyer, S.V.K. (2001) Pulse anodizing on AA1100 aluminium alloy in oxalic acid electrolyte. Bulletin of Electrochemistry , 17 (6). pp. 285-288. ISSN 0256-1654 Kanagaraj, D. and Mohan, S. and Renganathan, N.G. and Raj , V. and Venkataramanan, R. and Iyer, S.V. (1999) Impedance study of aluminium surface subjected to various surface treatments. Bulletin of Electrochemistry , 15 (3-4). pp. 164-168. ISSN 0256-1654 |