Mohan, S. and Raj, V. (2005) The effect of additives on the pulsed electrodeposition of copper. Transactions of the Institute of Metal Finishing, 83 (4). pp. 194-198. ISSN 0020-2967

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Abstract

The pulsed electrodepostion of copper has been systematically investigated from a copper sulphate bath. Pulse duty cycles of 5–80%, at frequencies from 10 to 100 Hz with current densities ranging from 2.5 to 7.5 A dm22 were employed. The influences of pulsed current duty cycle, peak current density and frequency on the thickness and hardness of the copper deposit, current efficiency and throwing power of the plating process were studied. The effect of additives, polyethylene glycol and di-sodium EDTA on the properties of deposit were investigated.

Item Type:	Article
Uncontrolled Keywords:	Pulse plating; Copper; Duty cycle; Frequency; Current efficiency; Throwing power
Subjects:	Electrodeposition Industrial Metal Finishing
Divisions:	UNSPECIFIED
Depositing User:	TTBD CECRI
Date Deposited:	18 Jan 2012 11:52
Last Modified:	18 Jan 2012 11:52
URI:	http://cecri.csircentral.net/id/eprint/229

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