Mukherjee, D. and Rajagopal, C. and Muralidharan, S. and Venkataraman, B. and Balakrishnan, K.
(1987)
Effect of pre-stress and post-stress relieving on the electro-crystallization of ni-p-b alloy.
Bulletin of Electrochemistry , 3 (5).
pp. 415-418.
ISSN 0256-1654
Abstract
It has been widely mentioned that the incorporation of metalloids like P and B, in the nickel matrix, improves the physicochemical
properties of nickel. An attempt has been made in this study to produce a coating of Ni:Fe-P-B, on mild steel substrate, which
is more cost-effective than Ni-P-B coating.
Bath formulation and current density for obtaining good deposit have been arrived at by voltammetric technique. The duration
of heat treatment of the substrate-surface, before and after coating, temperature and time of deposition were adjusted
for obtaining good deposits. The physicochemical properties of the deposited panels were also studied and compared.
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