Veeramani, P. and Silaimani, S.M. and John, S. (2006) Electroforming of Nickel-Tungsten alloy for high temperature applications. Indian Surface Finishing, 3 (3-4). pp. 359-367. ISSN 0972-9364

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Electroforming process is growing as production process for the fabrication of critical components which are used by aerospace and nuclear areas. Mainly nickel alloys like nickel-cobalt, nickel-molybdenum are currently electroformed for functional applications, In some of the critical components in nuclear applications nickel tungsten el ctroforming is required. Interest in nickel-tungsten alloys has increased in recent years due to their unique combination of tribological, magnetic, electrical and electrochemical properties (such as tensile strength. improved hardness & good wear resistance) and good resistance to strong oxidizing acids and high melting temperature. Possible future applications of nickel-tungsten alloys include barrier-layers or capping layers in copper metallization for ultra large scale integration devices (ULSI) or micro electromechanical systems (MEMS), mould inserts. magnetic heads and relays etc. The present investigation explained binary alloy deposition b'j induced co-deposition technique in nickel sulphamate electrolyte. The effect of temperature and current density on the percentage incorporation of tungsten was analyzed. Some of the properties like hardness and wear resistance were studied on these deposits.

Item Type: Article
Uncontrolled Keywords: Electroforming; alloy deposition; nickel-tungsten plating
Subjects: Industrial Metal Finishing
Depositing User: ttbdu cecri
Date Deposited: 25 Jan 2012 12:26
Last Modified: 25 Jan 2012 12:26

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