Kokila, P. and Lekshmanasarma, R. and Sriveeraraghavan, S. (2000) Hull cell studies on copper electrodeposition from sulphamate bath. Bulletin of Electrochemistry, 16 (08). pp. 363-366. ISSN 0256-1654

Preview

PDF - Published Version Download (3227Kb) | Preview

Abstract

Electrodeposited copper serves as a preplate before deposition of nickel, silver or gold. It is also used to prevent case hardening on selected areas of ferrous metal surface. Because of its enhanced electrical conductivity, it is used in electronics and in printed circuit board production. The grain structure of copper deposits from acid sulphate bath is less fine compared to the structure from cyanide baths. To copre up with the stringent pollution control regulations, there is a need to replace cyanide bath by non-toxic ones. There are a lot of plating compositions for copper deposition, based upon cyanide, sulphate, chloride etc. with proven usefulness in the industries. However, above types of bath are either toxic or highly acidic requiring pollution control treatments. Hence it was decided to investigate a bath which will be nontoxic. From view point, sulphamic acid was considered as one of the best alternatives as it is weakly acidic and nonpoisonous

Item Type:	Article
Uncontrolled Keywords:	Electrodeposition; Copper; Sulphamic acid; Hull cell
Subjects:	Industrial Metal Finishing
Divisions:	UNSPECIFIED
Depositing User:	ttbdu cecri
Date Deposited:	17 Dec 2012 06:19
Last Modified:	17 Dec 2012 06:19
URI:	http://cecri.csircentral.net/id/eprint/2965

Actions (login required)

View Item