Sekar, R. and Eagammai, C. and Sobha , J. (2010) Effect of additives on electrodeposition of tin and its structural and corrosion behaviour. Journal of Applied Electrochemistry, 40. pp. 49-57. ISSN 0021-891X

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Abstract

The present investigation deals with the electrodeposition of tin from chloride electrolytes. Gelatin, b-naphthol, polyethylene glycol, peptone and histidine were used as additives in the plating bath to improve the surface morphology, grain size, smoothness and corrosion resistance of the tin deposits. XRD data obtained for electrodeposited tin show polycrystalline nature with single b-phase and tetragonal structure. A uniform and pore free surface was observed under SEM analysis. AFM results indicate the grain refining brought about by the additives. Corrosion rate measurements using the Tafel extrapolation method and electrochemical impedance spectroscopy reveal the increased corrosion resistance from baths containing additives.

Item Type:	Article
Uncontrolled Keywords:	Additives; Tin electrodeposit; XRD studies; SEM analysis; � Potentiodynamic polarization; Atomic force microscopy; Electrochemical impedance
Subjects:	Industrial Metal Finishing
Divisions:	UNSPECIFIED
Depositing User:	ttbdar CECRI
Date Deposited:	20 Jan 2012 03:39
Last Modified:	20 Jan 2012 03:39
URI:	http://cecri.csircentral.net/id/eprint/293

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