Srinivasan, K.N. and Shanmugam, N.V. and Selvam, M. and John, S. and Shenoi, B.A. (1985) Electrolytic stain proofing of copper foils for printed circuit applications. Surface Technology, 26 (1). pp. 17-21. ISSN 0376-4583

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Abstract

This paper describes electrolytic stain proofing of copper foils in chromic acid solution containing suitable additives to produce a very thin protective film. The quality of stainproofing was checked by a tarnish resistance test, a solderability test and an etchability test. The treatment also offers good protection to copper and its alloys for very many applications in day to day life. The optimum bath composition consists of chromic acid 10 g l-1 and acetic acid 5 g l-1 and operates at a cathodic current density of 2.5 A dm-2 for 30 s at 30 deg.C

Item Type:	Article
Uncontrolled Keywords:	Electrolytic stainproofing; Copper foils; Printed circuit applications
Subjects:	Industrial Metal Finishing
Divisions:	UNSPECIFIED
Depositing User:	ttbdu cecri
Date Deposited:	01 Nov 2012 13:10
Last Modified:	01 Nov 2012 13:10
URI:	http://cecri.csircentral.net/id/eprint/2868

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