Renuka, R. and Ramamurthy, S.
(1997)
Electroplating of iron-phosphorous alloy part I – influence of reducing agents on the stability of the plating bath.
Bulletin of Electrochemistry, 13 (12).
pp. 456-460.
ISSN 0256-1654
Abstract
This paper examines the reactions that take place in an iron plating bath during the plating of iron on copper. The influence of adding reducing agents viz., iron powder, hydroxylamine, and hydrazine sulphate on the bath performance is discussed
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