Krishnan, R.M. and Muthumeenal, V. and Muralidharan, V.S. and Natarajan, S.R. (1990) A non-cyanide copper plating electrolyte for direct plating on mild steel. Bulletin of Electrochemistry, 06 (11). pp. 870-872. ISSN 0256-1654

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Abstract

Copper electrodeposits are employed for a number of applications such as decorative copper-nickel-chromium plating, production of printed circuit boards and selective case hardening. In general, copper is deposited on steel components exclusively from cyanide based electrolytes. In view of the toxicity of such electrolytes, work is being pursued all over the world for development of suitable noncyanide solutions. In this paper, the authors report the use of an electrolyte containing copper-NTA complex for production of adherent copper deposits on steel

Item Type:	Article
Uncontrolled Keywords:	Copper plating; Noncyanide solution; NTA containing copper bath
Subjects:	Industrial Metal Finishing
Divisions:	UNSPECIFIED
Depositing User:	ttbdu cecri
Date Deposited:	25 May 2012 09:10
Last Modified:	25 May 2012 09:10
URI:	http://cecri.csircentral.net/id/eprint/2749

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