Sobha , J. and Krishna, N. and Sujatha, K.P. and Sriveeraraghavan, S. and Krishnan, R.M. and Natarajan, S.R. (1996) Electroplating of Nickel-Copper alloys. Bulletin of Electrochemistry, 12 (5-6). pp. 259-265. ISSN 0256-1654

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Abstract

Nickel-Copper alloy with 30% Nickel has Monel like properties with excellent resistant to corrosion and erosion. This alloy deposited over steel substrate has been recommended as a cost-effective replacement for cast Monel for applications in different environments. This paper deals with the investigations on the development of a stable bath for electroplating this alloy. A suitable bath is reported on the basis of Hull cell studies, plating experiments, determination of alloy plating efficiency and composition of the plated alloy. Effects of operating parameters on deposition characteristics and deposit properties are also reported.

Item Type:	Article
Uncontrolled Keywords:	Nickel-Copper alloys; hull cell electroplating
Subjects:	Industrial Metal Finishing
Divisions:	UNSPECIFIED
Depositing User:	ttbdar CECRI
Date Deposited:	23 May 2012 09:19
Last Modified:	23 May 2012 09:19
URI:	http://cecri.csircentral.net/id/eprint/2708

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