Venkatachalam, R. and Kanakaraj, D. and Narasimhan, V.L. and Subramanian, R. (1986) Lead-tin-copper alloy deposition from fluoborate solutions. Bulletin of Electrochemistry , 2 (3). pp. 261-263. ISSN 0256-1654

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Abstract

The eledrodeposition of lead-tinqper alloy from fluoborate solution has been reported. The effects of addition agent, armnt density, copper content and total metal content of the bath on the alloy amposition have been discussed. The structure of the alloy obtained has been compared with that of lead-tin alloy with the help of SEM.

Item Type:	Article
Uncontrolled Keywords:	W-SnCu alloy deposition; fluoborate bath
Subjects:	Industrial Metal Finishing
Divisions:	UNSPECIFIED
Depositing User:	ttbdar CECRI
Date Deposited:	23 Mar 2012 13:35
Last Modified:	23 Mar 2012 13:35
URI:	http://cecri.csircentral.net/id/eprint/2204

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