Krishnan, R.M. and Sriveeraraghavan, S. and Natarajan, S.R. (1986) Thiosulphate baths for silver plating. Bulletin of Electrochemistry , 2 (3). pp. 257-260. ISSN 0256-1654

PDF - Published Version
Download (243Kb) | Preview


Electroplating silver from thiosulphates solutions has received increasing attention recently because of the emphasis on pollution-free prooesses. This paper reports the results of studies for identifying suitable compositions for silver plating. Different aspects encompassing stability, mnductivity, cathode current efficiencv. deposition rate and throwing power of solutions as well as deposit properties like appearance. microhakness and adhesion were examined. The preplating sequence fro improving deposit adhesion was also investigated. The studies enabled identification of two methods of wetreatment and production of sound deposits with good adhesion to copper and.nickel plated copper. specimens.

Item Type: Article
Subjects: Industrial Metal Finishing
Depositing User: ttbdar CECRI
Date Deposited: 21 Mar 2012 05:23
Last Modified: 21 Mar 2012 05:23

Actions (login required)

View Item View Item