Krishnan, R.M. and Sriveeraraghavan, S. and Natarajan, S.R.
(1986)
Thiosulphate baths for silver plating.
Bulletin of Electrochemistry , 2 (3).
pp. 257-260.
ISSN 0256-1654
Abstract
Electroplating silver from thiosulphates solutions has received increasing attention recently because of the
emphasis on pollution-free prooesses. This paper reports the results of studies for identifying suitable
compositions for silver plating. Different aspects encompassing stability, mnductivity, cathode current
efficiencv. deposition rate and throwing power of solutions as well as deposit properties like appearance.
microhakness and adhesion were examined. The preplating sequence fro improving deposit adhesion
was also investigated. The studies enabled identification of two methods of wetreatment and production
of sound deposits with good adhesion to copper and.nickel plated copper. specimens.
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