Kanakaraj, D. and Venkatachalam, R. and Narasimhan, V.L. and Subramanian, R. (1986) Plating on anodised aluminium. Bulletin of Electrochemistry , 2 (3). pp. 273-275. ISSN 0256-1654

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Laboratory scale investigation on the use of sulphuric-oxalic acid anodismg bath for plating purposes are presented and the results of this bath are compared with other standard baths after plating in respect of coverage, adhesion etc. The experimental results indicate that direct plating of copper isquite possible on oxide films formed from sulphuric-oxalic acid bath with good coverage, adhesion and fairly higher thickness from an acid copper bath.

Item Type: Article
Uncontrolled Keywords: Anodised aluminium; copper electroplating; H2S04- Oxalic acid bath
Subjects: Industrial Metal Finishing
Depositing User: ttbdar CECRI
Date Deposited: 21 Mar 2012 05:19
Last Modified: 21 Mar 2012 05:19
URI: http://cecri.csircentral.net/id/eprint/2116

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