Subramanian, B. and Jayakumar, S. and Jayachandran, M. and Sobha , J. (2005) Studies on nickel electrodeposits on dc magnetron sputtered copper substrates. Surface Engineering, 21 (2). pp. 151-155. ISSN 0267-0844

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Abstract

Investigations into nickel electrodeposits on dc magnetron sputtered copper substrates are reported. Thin layers of copper were deposited by dc magnetron sputtering on mild steel substrates. Onto these sputtered copper surface, layers of nickel were electrodeposited using a Watt’s bath. The coatings were vacuum annealed at 200uC for 120 min. The growth of the deposit is discussed in terms of structural and microstructural analysis by X-ray diffraction (XRD), SEM and atomic force microscopy (AFM). The orientation along (111), (200) and (220) was observed for the vacuum annealed Cu3.8Ni alloy deposits. Uniform and pinhole free morphology was observed from SEM. AFM images reveal that these coatings have a granular morphology. The corrosion behaviour of these samples in a 3.5 wt-%NaCl solution was examined. A decrease in Icorr and high charge transfer resistance indicated the improved corrosion resistant behaviour of the nickel sample plated over a sputtered copper base.

Item Type:	Article
Uncontrolled Keywords:	Magnetron sputtering; PVD, Electroplating; Metallic coating; Electrochemical impedance spectroscopy; Morphology; Characterisation methods; SEM; AFM, X- ray diffraction; Corrosion; Cu–Ni alloy; Corrosion resistance; Potentiodynamic polarisation studies; Nyquist plot; Metals and alloys
Subjects:	Industrial Metal Finishing Electrochemical Materials Science
Divisions:	UNSPECIFIED
Depositing User:	TTBD CECRI
Date Deposited:	18 Jan 2012 16:07
Last Modified:	18 Jan 2012 16:07
URI:	http://cecri.csircentral.net/id/eprint/191

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