Sobha , J. and Natarajan, S.R. and John, S. (1988) Palladium plating for electronic applications. Bulletin of Electrochemistry , 04 (09). pp. 793-796. ISSN 0256-1654

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Abstract

Palladium has been found to be a viable alternative to gold for contact surfaces in the electronic industry on account of iD low cost, good resistance to corrosion and tarnishing, good solderability and good electrical conductivity. The present papa deals with the palladium bath performance, deposit characteristics and bath stability

Item Type:	Article
Uncontrolled Keywords:	Palladium plating; Electronic industry; Electroplating
Subjects:	Industrial Metal Finishing
Divisions:	UNSPECIFIED
Depositing User:	ttbdu cecri
Date Deposited:	25 Mar 2012 16:12
Last Modified:	25 Mar 2012 16:12
URI:	http://cecri.csircentral.net/id/eprint/1562

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