Sriveeraraghavan, S. and Silvester, P. and Krishnan, R.M. and Sobha, J. and Natarajan, S.R. and Balakrishnan, K. (1998) Copper deposition from perchlorate based electrolytes. Bulletin of Electrochemistry, 14 (10). pp. 320-325.

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Abstract

Copper is electroplated for a wide variety ofapplications with the elecll'oplating being carried out nonnally from cyanide or acid sulphate solutions. Experimentnl ohservations during the development of a perchlorate-hased copper plating solution suggest that this electrolyte rniJ.:ht he useru in industrial electroplating.

Item Type:	Article
Uncontrolled Keywords:	Copper electrodeposition; optimum composition; perchlorate electrolyte
Subjects:	Industrial Metal Finishing
Divisions:	UNSPECIFIED
Depositing User:	ttbdar CECRI
Date Deposited:	20 Feb 2012 06:15
Last Modified:	20 Feb 2012 06:15
URI:	http://cecri.csircentral.net/id/eprint/1402

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