Mohan, S. and Rajasekaran, N. (2009) Pulse electrodeposition of tin from sulphate bath. Surface Engineering, 25 (8). pp. 634-638. ISSN 0267-0844

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Abstract

In the present work, the pulse electrodeposition of tin from sulphate bath containing SnSO4, H2SO4, phenol sulphonic acid, gelatin and ß-napthol has been studied. The influences of pulsed current, duty cycle on the thickness, hardness and current efficiency of the tin deposit were studied. Electrochemical corrosion studies of the deposited tin on mild steel were conducted by potentiodynamic polarisation and electrochemical impedance spectroscopy. Cyclic voltammetry studies using potential sweep of 10 mV s21 provide information about the potential ranges for tin deposition and stripping. The tin deposit on a brass substrate has been investigated using XRD, SEM and AFM. The XRD analysis revealed that the tin plated is Sn(200) and crystalline. The morphology of tin deposit is a typical fine grained and granular structure as seen from SEM and AFM.

Item Type:	Article
Uncontrolled Keywords:	Pulse current; Tin; Hardness; Cyclic voltammetry
Subjects:	Industrial Metal Finishing
Divisions:	UNSPECIFIED
Depositing User:	ttbdu cecri
Date Deposited:	08 Apr 2012 14:49
Last Modified:	08 Apr 2012 14:49
URI:	http://cecri.csircentral.net/id/eprint/1196

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