John, S. and Ananth, V. and Vasudevan, T.
(1999)
Improving the deposit distribution during electroforming of complicated shapes.
Bulletin of Electrochemistry , 15 (5-6).
pp. 202-204.
ISSN 0256-1654
Abstract
Electroforming involves the deposition of metals to higher thicknesses so that tbe deposit itself stands as a separate article for use in various functional applications. In this process consitlerable amount of metal is deposited at the projections, corners and edges and hence the wastage of metal is of the order of 100-200% over and above the requirement. TIlis is due to the inherent nature of the electrodeposition process namely nonuniform current and metal distribution. Ions are invisible to man and their propulsion and manipulation through electrolytes is not nearly so controllable as that of electrons through metals and semiconductors at fto.ast relative to tbe purpose to be achieved. Modlncatlons of the deposit distribution pattern can be achieved by changing the geometry of the part, by using 8uxiliarly anodes or shields or by chan~ing the rack design. Good throwing power is that property of the plating solution which produces a relatively unifonn distribution of metal upon a catlIode of irregular shape. In the present study a slotted HuU Cell has been used to study the distribution of metal on a plate kept at an inclined position with respect to the anode. It has been concluded from the study that metal distribution is as uniform as possible when metal ions are injected through narrow slots due to the scattering of electric field in the deposition cell.
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