Chandrasekar, M.S. and Pushpavanam, M. (2008) Pulse and pulse reverse plating—Conceptual,advantages and applications. Electrochimica Acta, 53 (8). pp. 3313-3322.

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A review on pulse and pulse reverse techniques for electrodeposition have been attempted. Pulse electrodeposition (PED) of some metals and alloys are reported. The effects of mass, transport, electrical double layer pulse parameters and current distribution on surface roughness and morphology are presented. Applications, advantages and disadvantages of PC and PRC techniques are discussed along with theoretical aspects and mechanism.

Item Type: Article
Uncontrolled Keywords: Pulse current (PC) electrodeposition; Pulse reverse current (PRC); Individual metals and their alloys; Composites and semiconductor; Applications
Subjects: Industrial Metal Finishing
Depositing User: ttbdu cecri
Date Deposited: 16 Jan 2012 16:11
Last Modified: 16 Jan 2012 16:11

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