Subramanian, B. and Jayachandran, M. and Jayakrishnan, S. (2006) Sequential deposition of Cu-Ni by electron beam evaporation and its characterisation. Transactions of the Institute of Metal Finishing, 84 (1). pp. 52-55. ISSN 0020-2967

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Abstract

Sequential deposition of Cu-Ni was carried out on glass and mild steel substrates by electron beam evaporation technique. The films were vacuum annealed at 200°C for 1 h. A smooth deposit with 7.8 pm thickness was observed using a profilometer. The polycrystalline nature with FCC structure of the films was determined with X-ray diffraction analysis. The uniform coverage of film surface was observed with atomic force microscopy (AFM). X-ray fluorescence (XRF) showed a change in composition for the vacuum annealed Cu-Ni film. A high transmittance in the visible region and a very low transmittance in the infrared region were observed for these films. Corrosion behaviour of the evaporated Cu-Ni films in 3.5% wlv NaCl solution was examined.

Item Type:	Article
Uncontrolled Keywords:	Metallic coatings; PVD; Electron beam evaporation; Corrosion Nyquist plot
Subjects:	Electrochemical Materials Science
Divisions:	UNSPECIFIED
Depositing User:	ttbdu cecri
Date Deposited:	06 Apr 2012 15:10
Last Modified:	06 Apr 2012 15:10
URI:	http://cecri.csircentral.net/id/eprint/856

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