Aravinda, C.L. and Mayanna, S.M. and Muralidharan, V.S. (2000) Electrochemical behaviour of alkaline copper complexes. Proceedings of the Indian Academy of Science, 112 (5). pp. 543-550.

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A search for non-cyanide plating baths for copper resulted in the development of alkaline copper complex baths containing trisodium citrate [TSC] and triethanolamine [TEA]. Voltammetric studies were carried out on platinum to understand the electrochemical behaviour of these complexes. In TSC solutions, the deposition of copper involves the slow formation of a monovalent species. Adsorption of this species obeys Langmuir isotherm. In TEA solutions the deposition involves the formation of monovalent ions obeying the non-activated Temkin isotherm. Conversion of divalent to monovalent copper is also slow. In TEA and TSC alkaline copper solutions, the predominant species that undergo stepwise reduction contain only TEA ligands.

Item Type: Article
Uncontrolled Keywords: Alkaline copper complexes; non-cyanide plating
Subjects: Corrosion Science and Engineering
Depositing User: ttbdar CECRI
Date Deposited: 07 Mar 2012 07:02
Last Modified: 07 Mar 2012 07:02

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