Aravinda, C.L. and Mayanna, S.M. and Muralidharan, V.S.
(2000)
Electrochemical behaviour of alkaline copper complexes.
Proceedings of the Indian Academy of Science, 112 (5).
pp. 543-550.
Abstract
A search for non-cyanide plating baths for copper resulted in the
development of alkaline copper complex baths containing trisodium citrate [TSC] and
triethanolamine [TEA]. Voltammetric studies were carried out on platinum to
understand the electrochemical behaviour of these complexes. In TSC solutions, the
deposition of copper involves the slow formation of a monovalent species. Adsorption
of this species obeys Langmuir isotherm. In TEA solutions the deposition involves the
formation of monovalent ions obeying the non-activated Temkin isotherm.
Conversion of divalent to monovalent copper is also slow. In TEA and TSC alkaline
copper solutions, the predominant species that undergo stepwise reduction contain
only TEA ligands.
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